Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
METHOD OF DISMANTLING AND REMOVING ALC PLATE OF PCB PROCESSING FACILITY
To provide a method of dismantling and removing the ALC plate of a PCB processing facility suitable for dismantling large-scale PCB processing facilities that use tens of thousands of ALC plates, omitting temporary scaffolding work, and omitting sheet curing to prevent contamination.SOLUTION: The method of dismantling and removing an ALC plate 3 of the PCB processing facility of the present invention is a method of dismantling and removing a plurality of ALC plates 3 including a contaminated surface having a contaminated portion in the building structure of the PCB processing facility contaminated with PCB. A peeling facility 40 for automatically peeling the contaminated surface having a contaminated part of the ALC plate 3 is installed. A plurality of ALC plates 3 are removed from the building structure and transferred to the peeling facility 40. The contaminated surface having the contaminated portion of the ALC plate 3 is peeled off by the peeling facility 40. A pollutant 8 generated by the peeling and the non-pollutant including the ALC plate 3 after the peeling are separated. The pollutant 8 and the non-pollutant are carried out of the PCB treatment facility, respectively.SELECTED DRAWING: Figure 1
【課題】ＡＬＣ版を数万枚用いているような大規模なＰＣＢ処理施設の解体工事に適し、足場設置の仮設工事の省略でき、コンタミの防止のためのシート養生を省略できるＰＣＢ処理施設のＡＬＣ版を解体撤去する方法を提供すること。【解決手段】本発明のＰＣＢ処理施設のＡＬＣ版３を解体撤去する方法は、ＰＣＢに汚染されたＰＣＢ処理施設の建築構造物のうち、汚染部を有する汚染面を含む複数のＡＬＣ版３を解体撤去する方法であって、ＡＬＣ版３の汚染部を有する汚染面を自動剥離する剥離設備４０を設置し、複数のＡＬＣ版３を建築構造物から外して剥離設備４０に移送し、剥離設備４０によりＡＬＣ版３の汚染部を有する汚染面を剥離し、剥離により発生した汚染物８と、剥離後のＡＬＣ版３を含む非汚染物に分離し、汚染物８と非汚染物とをそれぞれＰＣＢ処理施設外に搬出する。【選択図】図１
METHOD OF DISMANTLING AND REMOVING ALC PLATE OF PCB PROCESSING FACILITY
To provide a method of dismantling and removing the ALC plate of a PCB processing facility suitable for dismantling large-scale PCB processing facilities that use tens of thousands of ALC plates, omitting temporary scaffolding work, and omitting sheet curing to prevent contamination.SOLUTION: The method of dismantling and removing an ALC plate 3 of the PCB processing facility of the present invention is a method of dismantling and removing a plurality of ALC plates 3 including a contaminated surface having a contaminated portion in the building structure of the PCB processing facility contaminated with PCB. A peeling facility 40 for automatically peeling the contaminated surface having a contaminated part of the ALC plate 3 is installed. A plurality of ALC plates 3 are removed from the building structure and transferred to the peeling facility 40. The contaminated surface having the contaminated portion of the ALC plate 3 is peeled off by the peeling facility 40. A pollutant 8 generated by the peeling and the non-pollutant including the ALC plate 3 after the peeling are separated. The pollutant 8 and the non-pollutant are carried out of the PCB treatment facility, respectively.SELECTED DRAWING: Figure 1
【課題】ＡＬＣ版を数万枚用いているような大規模なＰＣＢ処理施設の解体工事に適し、足場設置の仮設工事の省略でき、コンタミの防止のためのシート養生を省略できるＰＣＢ処理施設のＡＬＣ版を解体撤去する方法を提供すること。【解決手段】本発明のＰＣＢ処理施設のＡＬＣ版３を解体撤去する方法は、ＰＣＢに汚染されたＰＣＢ処理施設の建築構造物のうち、汚染部を有する汚染面を含む複数のＡＬＣ版３を解体撤去する方法であって、ＡＬＣ版３の汚染部を有する汚染面を自動剥離する剥離設備４０を設置し、複数のＡＬＣ版３を建築構造物から外して剥離設備４０に移送し、剥離設備４０によりＡＬＣ版３の汚染部を有する汚染面を剥離し、剥離により発生した汚染物８と、剥離後のＡＬＣ版３を含む非汚染物に分離し、汚染物８と非汚染物とをそれぞれＰＣＢ処理施設外に搬出する。【選択図】図１
METHOD OF DISMANTLING AND REMOVING ALC PLATE OF PCB PROCESSING FACILITY
ＰＣＢ処理施設のＡＬＣ版を解体撤去する方法
MAEMURA TOSHIHIKO (Autor:in) / FUKUI KAORU (Autor:in) / UMEMOTO TAKAHIRO (Autor:in) / OI KAZUHIKO (Autor:in)
16.09.2021
Patent
Elektronische Ressource
Japanisch
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