Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
HEATSINK AND METHOD OF MANUFACTURING THE SAME
To provide an inexpensive heatsink with high thermal conductivity, and a method of manufacturing the same.SOLUTION: A heatsink with an electronic component mounted thereon includes a first surface in which a mounting area for mounting the electronic component is defined, and a second surface facing the first surface. The heatsink is configured by binding main materials having thermal conductivity higher than glass, using glass as a binder, and has insulation property.SELECTED DRAWING: Figure 1
【課題】熱伝導性が高く、かつ安価な放熱基板およびその製造方法を提供する。【解決手段】電子部品を搭載可能な放熱基板であって、放熱基板は、電子部品を搭載する搭載領域が定義された第１面と、第１面に対向する第２面とを備え、熱伝導性がガラスよりも高い主原料がガラスを結合剤として結合された構造であって、絶縁性を有する。【選択図】図１
HEATSINK AND METHOD OF MANUFACTURING THE SAME
To provide an inexpensive heatsink with high thermal conductivity, and a method of manufacturing the same.SOLUTION: A heatsink with an electronic component mounted thereon includes a first surface in which a mounting area for mounting the electronic component is defined, and a second surface facing the first surface. The heatsink is configured by binding main materials having thermal conductivity higher than glass, using glass as a binder, and has insulation property.SELECTED DRAWING: Figure 1
【課題】熱伝導性が高く、かつ安価な放熱基板およびその製造方法を提供する。【解決手段】電子部品を搭載可能な放熱基板であって、放熱基板は、電子部品を搭載する搭載領域が定義された第１面と、第１面に対向する第２面とを備え、熱伝導性がガラスよりも高い主原料がガラスを結合剤として結合された構造であって、絶縁性を有する。【選択図】図１
HEATSINK AND METHOD OF MANUFACTURING THE SAME
放熱基板およびその製造方法
NAKAYA GORO (Autor:in)
28.04.2023
Patent
Elektronische Ressource
Japanisch
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