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Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SUBSTRATE FOR POWER MODULE WITH HEATSINK
PROBLEM TO BE SOLVED: To enhance bonding reliability of each substrate for power module and a heatsink, while ensuring excellent heat dissipation performance, when bonding a plurality of substrates for power modules to one heatsink.SOLUTION: A manufacturing apparatus 50 of the substrate for power module with a heatsink includes compression means 60 for compressing a laminate 25, where a plurality of substrates 10 for power modules are arranged on a heatsink 20 while being superposed, in the lamination direction thereof. The compression means 60 has a plurality of upper compression plates 70 for pressing the surface of the circuit layer 12 on the substrate 10 for power module individually, one lower compression plate 80 for pressing the back of the heatsink 20, and energization means 90 for giving a pressing force to the upper compression plates 70.SELECTED DRAWING: Figure 1
【課題】複数のパワーモジュール用基板を一枚の放熱板に接合する場合において、各パワーモジュール用基板と放熱板との接合信頼性を高めるとともに、良好な放熱性能を確保する。【解決手段】放熱板付パワーモジュール用基板の製造装置５０は、複数のパワーモジュール用基板１０を放熱板２０に重ねて配置した積層体２５を、その積層方向に加圧する加圧手段６０を備え、加圧手段６０は、パワーモジュール用基板１０の回路層１２表面を個別に押圧するための複数の上側加圧板７０と、放熱板２０背面を押圧するための一枚の下側加圧板８０と、上側加圧板７０に押圧力を付加する付勢手段９０とを有する。【選択図】 図１
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SUBSTRATE FOR POWER MODULE WITH HEATSINK
PROBLEM TO BE SOLVED: To enhance bonding reliability of each substrate for power module and a heatsink, while ensuring excellent heat dissipation performance, when bonding a plurality of substrates for power modules to one heatsink.SOLUTION: A manufacturing apparatus 50 of the substrate for power module with a heatsink includes compression means 60 for compressing a laminate 25, where a plurality of substrates 10 for power modules are arranged on a heatsink 20 while being superposed, in the lamination direction thereof. The compression means 60 has a plurality of upper compression plates 70 for pressing the surface of the circuit layer 12 on the substrate 10 for power module individually, one lower compression plate 80 for pressing the back of the heatsink 20, and energization means 90 for giving a pressing force to the upper compression plates 70.SELECTED DRAWING: Figure 1
【課題】複数のパワーモジュール用基板を一枚の放熱板に接合する場合において、各パワーモジュール用基板と放熱板との接合信頼性を高めるとともに、良好な放熱性能を確保する。【解決手段】放熱板付パワーモジュール用基板の製造装置５０は、複数のパワーモジュール用基板１０を放熱板２０に重ねて配置した積層体２５を、その積層方向に加圧する加圧手段６０を備え、加圧手段６０は、パワーモジュール用基板１０の回路層１２表面を個別に押圧するための複数の上側加圧板７０と、放熱板２０背面を押圧するための一枚の下側加圧板８０と、上側加圧板７０に押圧力を付加する付勢手段９０とを有する。【選択図】 図１
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SUBSTRATE FOR POWER MODULE WITH HEATSINK
放熱板付パワーモジュール用基板の製造装置及び製造方法
MATSUO TAKUYA (Autor:in) / ISHIZUKA HIROYA (Autor:in)
25.04.2016
Patent
Elektronische Ressource
Japanisch
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