Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
To provide a heat shielding structure having more excellent heat shielding properties than conventional ones.SOLUTION: A heat shielding structure includes a base material and a heat shielding layer formed on one main surface of the base material, wherein: the base material comprises a porous ceramic; the heat shielding layer has a bulk density of 2 g/cm3 or less; a ratio of pores having a pore diameter of 0.5 μm or more but less than 10 μm in a total pore volume of the heat shielding layer is 40 vol% or more; a ratio of pores having a pore diameter of 1 μm or more but less than 5 μm in the pore volume of 0.5 μm or more but less than 10 μm is 50 vol% or more; and a ratio of pores having a pore diameter of greater than 5.5 μm in the total pore volume of the heat shielding layer is 55 vol% or less.SELECTED DRAWING: None
【課題】従来よりも遮熱特性に優れた遮熱構造体を提供する。【解決手段】本発明の一つの態様では、基材と前記基材の一主面上に形成された遮熱層からなる遮熱構造体であって、前記基材は多孔質セラミックスからなり、前記遮熱層は、嵩密度が２ｇ/ｃｍ3以下であり、前記遮熱層の全気孔容積中において気孔径０．５μｍ以上１０μｍ未満の気孔が占める割合が４０ｖｏｌ％以上、気孔径０．５μｍ以上１０μｍ未満の気孔容積中における気孔径１μｍ以上５μｍ未満の気孔が占める割合が５０ｖｏｌ％以上、前記遮熱層の全気孔容積中において気孔径５．５μｍより大きい気孔が占める割合が５５ｖｏｌ％以下、であることを特徴とする。【選択図】なし
To provide a heat shielding structure having more excellent heat shielding properties than conventional ones.SOLUTION: A heat shielding structure includes a base material and a heat shielding layer formed on one main surface of the base material, wherein: the base material comprises a porous ceramic; the heat shielding layer has a bulk density of 2 g/cm3 or less; a ratio of pores having a pore diameter of 0.5 μm or more but less than 10 μm in a total pore volume of the heat shielding layer is 40 vol% or more; a ratio of pores having a pore diameter of 1 μm or more but less than 5 μm in the pore volume of 0.5 μm or more but less than 10 μm is 50 vol% or more; and a ratio of pores having a pore diameter of greater than 5.5 μm in the total pore volume of the heat shielding layer is 55 vol% or less.SELECTED DRAWING: None
【課題】従来よりも遮熱特性に優れた遮熱構造体を提供する。【解決手段】本発明の一つの態様では、基材と前記基材の一主面上に形成された遮熱層からなる遮熱構造体であって、前記基材は多孔質セラミックスからなり、前記遮熱層は、嵩密度が２ｇ/ｃｍ3以下であり、前記遮熱層の全気孔容積中において気孔径０．５μｍ以上１０μｍ未満の気孔が占める割合が４０ｖｏｌ％以上、気孔径０．５μｍ以上１０μｍ未満の気孔容積中における気孔径１μｍ以上５μｍ未満の気孔が占める割合が５０ｖｏｌ％以上、前記遮熱層の全気孔容積中において気孔径５．５μｍより大きい気孔が占める割合が５５ｖｏｌ％以下、であることを特徴とする。【選択図】なし
HEAT SHIELDING STRUCTURE
遮熱構造体
AKAMINE SHUKO (Autor:in)
13.12.2023
Patent
Elektronische Ressource
Japanisch
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