METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE: Fid-Bau Portal

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METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE

TERASAKI NOBUYUKI / NAGATOMO YOSHIYUKI

이 파워 모듈용 기판의 제조 방법은, 활성 금속재 및 융점이 710 ℃ 이하인 용가재를 개재하여 세라믹스 부재 (11) 와 구리 부재 (12) 를 적층시키는 적층 공정과, 적층된 세라믹스 부재 (11) 및 구리 부재 (12) 를 가열 처리하는 가열 처리 공정을 구비하고 있다.

A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member (11) and a copper member (12) through an active metal material and a filler metal having a melting point of 710°C or lower, and a heating treatment step of heating the ceramic member (11) and the copper member (12) laminated together.

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METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE

TERASAKI NOBUYUKI / NAGATOMO YOSHIYUKI

이 파워 모듈용 기판의 제조 방법은, 활성 금속재 및 융점이 710 ℃ 이하인 용가재를 개재하여 세라믹스 부재 (11) 와 구리 부재 (12) 를 적층시키는 적층 공정과, 적층된 세라믹스 부재 (11) 및 구리 부재 (12) 를 가열 처리하는 가열 처리 공정을 구비하고 있다.

A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member (11) and a copper member (12) through an active metal material and a filler metal having a melting point of 710°C or lower, and a heating treatment step of heating the ceramic member (11) and the copper member (12) laminated together.

METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE

TERASAKI NOBUYUKI / NAGATOMO YOSHIYUKI

이 파워 모듈용 기판의 제조 방법은, 활성 금속재 및 융점이 710 ℃ 이하인 용가재를 개재하여 세라믹스 부재 (11) 와 구리 부재 (12) 를 적층시키는 적층 공정과, 적층된 세라믹스 부재 (11) 및 구리 부재 (12) 를 가열 처리하는 가열 처리 공정을 구비하고 있다.

A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member (11) and a copper member (12) through an active metal material and a filler metal having a melting point of 710°C or lower, and a heating treatment step of heating the ceramic member (11) and the copper member (12) laminated together.

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Titel:

METHOD FOR MANUFACTURING BONDED BODY AND METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE

Weitere Titelangaben:

접합체의 제조 방법 및 파워 모듈용 기판의 제조 방법

Beteiligte:

TERASAKI NOBUYUKI (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in)

Erscheinungsdatum:

27.11.2015

Medientyp:

Patent

Format:

Elektronische Ressource

Sprache:

Koreanisch

Klassifikation:

IPC: H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / C04B Kalk , LIME

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