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    Method for manufacturing bonded body and method for manufacturing power-module substrate

    Neue Suche nach: TERASAKI NOBUYUKI
    Neue Suche nach: NAGATOMO YOSHIYUKI

    A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member and a copper member through an active metal material and a filler metal having a melting point of 710° C. or lower, and a heating treatment step of heating the ceramic member and the copper member laminated together.

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    Method for manufacturing bonded body and method for manufacturing power-module substrate

    Neue Suche nach: TERASAKI NOBUYUKI
    Neue Suche nach: NAGATOMO YOSHIYUKI

    A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member and a copper member through an active metal material and a filler metal having a melting point of 710° C. or lower, and a heating treatment step of heating the ceramic member and the copper member laminated together.

    Zugriff

    Download

    Method for manufacturing bonded body and method for manufacturing power-module substrate

    Neue Suche nach: TERASAKI NOBUYUKI
    Neue Suche nach: NAGATOMO YOSHIYUKI

    A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member and a copper member through an active metal material and a filler metal having a melting point of 710° C. or lower, and a heating treatment step of heating the ceramic member and the copper member laminated together.

    Zugriff

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    Zugriff

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    Ähnliche Titel

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    Titel:

    Method for manufacturing bonded body and method for manufacturing power-module substrate

    Beteiligte:

    TERASAKI NOBUYUKI (Autor:in) / NAGATOMO YOSHIYUKI (Autor:in)

    Erscheinungsdatum:

    05.02.2019

    Medientyp:

    Patent

    Format:

    Elektronische Ressource

    Sprache:

    Englisch

    Klassifikation:

    IPC:  H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / C04B Kalk , LIME

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