Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Described herein is a method of installing a ceiling system comprising adhesively bonding together a ceiling panel and a magnetic attachment element to form a ceiling panel assembly, magnetically coupling the ceiling panel assembly to at least one suspended support element; and wherein the ceiling panel and the magnetic attachment element are adhesively bonded together a the time of installation.
Described herein is a method of installing a ceiling system comprising adhesively bonding together a ceiling panel and a magnetic attachment element to form a ceiling panel assembly, magnetically coupling the ceiling panel assembly to at least one suspended support element; and wherein the ceiling panel and the magnetic attachment element are adhesively bonded together a the time of installation.
Ceiling panel attachment assembly
DEPAUL MARIE A (Autor:in)
07.11.2023
Patent
Elektronische Ressource
Englisch
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS