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Described herein is a method of installing a ceiling system comprising adhesively bonding together a ceiling panel and a magnetic attachment element to form a ceiling panel assembly, magnetically coupling the ceiling panel assembly to at least one suspended support element; and wherein the ceiling panel and the magnetic attachment element are adhesively bonded together a the time of installation.
Described herein is a method of installing a ceiling system comprising adhesively bonding together a ceiling panel and a magnetic attachment element to form a ceiling panel assembly, magnetically coupling the ceiling panel assembly to at least one suspended support element; and wherein the ceiling panel and the magnetic attachment element are adhesively bonded together a the time of installation.
Ceiling panel attachment assembly
DEPAUL MARIE A (author)
2023-11-07
Patent
Electronic Resource
English
IPC:
E04B
Allgemeine Baukonstruktionen
,
GENERAL BUILDING CONSTRUCTIONS