Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
PACKAGE BASE, PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT
A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.
PACKAGE BASE, PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT
A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.
PACKAGE BASE, PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT
MIYAO TETSURO (Autor:in) / ISHIGAMI HIDEKI (Autor:in) / SHIOHARA YUKIHIKO (Autor:in) / OTSUKI TETSUYA (Autor:in) / NAKAMURA HIDEFUMI (Autor:in)
21.01.2016
Patent
Elektronische Ressource
Englisch
PACKAGE BASE MATERIAL, PACKAGE, AND METHOD FOR MANUFACTURING PACKAGE BASE MATERIAL
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