A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
PACKAGE BASE, PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT
A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.
PACKAGE BASE, PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT
A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.
PACKAGE BASE, PACKAGE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND MOVING OBJECT
MIYAO TETSURO (author) / ISHIGAMI HIDEKI (author) / SHIOHARA YUKIHIKO (author) / OTSUKI TETSUYA (author) / NAKAMURA HIDEFUMI (author)
2016-01-21
Patent
Electronic Resource
English
PACKAGE BASE MATERIAL, PACKAGE, AND METHOD FOR MANUFACTURING PACKAGE BASE MATERIAL
| European Patent Office | 2021
Method for producing package, method for producing electronic device, and electronic device
| European Patent Office | 2016