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CYLINDRICAL SPUTTERING TARGET, CYLINDRICAL COMPACT, MANUFACTURING METHOD OF CYLINDRICAL SPUTTERING TARGET, AND MANUFACTURING METHOD OF CYLINDRICAL SINTERED COMPACT
A cylindrical sputtering target includes a plurality of cylindrical sintered compacts adjacent to each other while having a space therebetween. The plurality of cylindrical sintered compacts have a relative density of 99.7% or higher and 99.9% or lower. The plurality of cylindrical sintered compacts adjacent to each other have a difference therebetween in the relative density of 0.1% or smaller.
CYLINDRICAL SPUTTERING TARGET, CYLINDRICAL COMPACT, MANUFACTURING METHOD OF CYLINDRICAL SPUTTERING TARGET, AND MANUFACTURING METHOD OF CYLINDRICAL SINTERED COMPACT
A cylindrical sputtering target includes a plurality of cylindrical sintered compacts adjacent to each other while having a space therebetween. The plurality of cylindrical sintered compacts have a relative density of 99.7% or higher and 99.9% or lower. The plurality of cylindrical sintered compacts adjacent to each other have a difference therebetween in the relative density of 0.1% or smaller.
CYLINDRICAL SPUTTERING TARGET, CYLINDRICAL COMPACT, MANUFACTURING METHOD OF CYLINDRICAL SPUTTERING TARGET, AND MANUFACTURING METHOD OF CYLINDRICAL SINTERED COMPACT
YAMAGUCHI YOHEI (Autor:in)
29.09.2016
Patent
Elektronische Ressource
Englisch
Europäisches Patentamt | 2017
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