Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
MODULAR BRIDGELESS THERMAL ENVELOPE FOR PREFABRICATED CONSTRUCTION
This application relates to methods of manufacturing a modular thermal envelope. The modular thermal envelope includes an internal structural frame. The modular thermal envelope further includes a non-structural insulated laminated wall panel. The modular thermal envelope further includes a bent clip. An example of a bent clip is a steel clip including a first portion welded to the structural interior frame element, a bent portion that defines a gap between the structural interior frame element, and a second portion of the bent clip. The modular thermal envelope has the non-structural insulated laminated wall panel positioned between the structural interior frame element and the second portion of the bent clip. The modular thermal envelope further is substantially weatherproof and airtight.
MODULAR BRIDGELESS THERMAL ENVELOPE FOR PREFABRICATED CONSTRUCTION
This application relates to methods of manufacturing a modular thermal envelope. The modular thermal envelope includes an internal structural frame. The modular thermal envelope further includes a non-structural insulated laminated wall panel. The modular thermal envelope further includes a bent clip. An example of a bent clip is a steel clip including a first portion welded to the structural interior frame element, a bent portion that defines a gap between the structural interior frame element, and a second portion of the bent clip. The modular thermal envelope has the non-structural insulated laminated wall panel positioned between the structural interior frame element and the second portion of the bent clip. The modular thermal envelope further is substantially weatherproof and airtight.
MODULAR BRIDGELESS THERMAL ENVELOPE FOR PREFABRICATED CONSTRUCTION
VITA JR LUCIEN A (Autor:in)
28.05.2020
Patent
Elektronische Ressource
Englisch
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