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    METHOD FOR COMPRESSING LAMINATE AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT INCLUDING LAMINATE

    Neue Suche nach: HONG YONG MIN
    Neue Suche nach: LEE JONG HO
    Neue Suche nach: CHOE YEONG JU
    Neue Suche nach: KIM CHUN SOO
    Neue Suche nach: JEONG JI HUN
    Neue Suche nach: YEON JE SIK

    Disclosed herein are relates to a method for compressing a laminate and a method for manufacturing a ceramic electronic component including a laminate. The method for compressing a laminate includes: preparing a laminate; pressurizing the laminate from a first pressure to a second pressure; heating the laminate from a first temperature to a second temperature; maintaining compression of the laminate at the second pressure and the second temperature for a predetermined time; cooling the laminate from the second temperature to a third temperature; and depressurizing the laminate from the second pressure to a third pressure, wherein the second temperature is 70° C. to 150° C.

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    METHOD FOR COMPRESSING LAMINATE AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT INCLUDING LAMINATE

    Neue Suche nach: HONG YONG MIN
    Neue Suche nach: LEE JONG HO
    Neue Suche nach: CHOE YEONG JU
    Neue Suche nach: KIM CHUN SOO
    Neue Suche nach: JEONG JI HUN
    Neue Suche nach: YEON JE SIK

    Disclosed herein are relates to a method for compressing a laminate and a method for manufacturing a ceramic electronic component including a laminate. The method for compressing a laminate includes: preparing a laminate; pressurizing the laminate from a first pressure to a second pressure; heating the laminate from a first temperature to a second temperature; maintaining compression of the laminate at the second pressure and the second temperature for a predetermined time; cooling the laminate from the second temperature to a third temperature; and depressurizing the laminate from the second pressure to a third pressure, wherein the second temperature is 70° C. to 150° C.

    Zugriff

    Download

    METHOD FOR COMPRESSING LAMINATE AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT INCLUDING LAMINATE

    Neue Suche nach: HONG YONG MIN
    Neue Suche nach: LEE JONG HO
    Neue Suche nach: CHOE YEONG JU
    Neue Suche nach: KIM CHUN SOO
    Neue Suche nach: JEONG JI HUN
    Neue Suche nach: YEON JE SIK

    Disclosed herein are relates to a method for compressing a laminate and a method for manufacturing a ceramic electronic component including a laminate. The method for compressing a laminate includes: preparing a laminate; pressurizing the laminate from a first pressure to a second pressure; heating the laminate from a first temperature to a second temperature; maintaining compression of the laminate at the second pressure and the second temperature for a predetermined time; cooling the laminate from the second temperature to a third temperature; and depressurizing the laminate from the second pressure to a third pressure, wherein the second temperature is 70° C. to 150° C.

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    Titel:

    METHOD FOR COMPRESSING LAMINATE AND METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT INCLUDING LAMINATE

    Beteiligte:

    HONG YONG MIN (Autor:in) / LEE JONG HO (Autor:in) / CHOE YEONG JU (Autor:in) / KIM CHUN SOO (Autor:in) / JEONG JI HUN (Autor:in) / YEON JE SIK (Autor:in)

    Erscheinungsdatum:

    13.04.2023

    Medientyp:

    Patent

    Format:

    Elektronische Ressource

    Sprache:

    Englisch

    Klassifikation:

    IPC:  B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM , Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse / C04B Kalk , LIME

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