Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Solderability enhancement by silver immersion printed circuit board manufacture
A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.
Solderability enhancement by silver immersion printed circuit board manufacture
A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.
Solderability enhancement by silver immersion printed circuit board manufacture
SOUTAR ANDREW MCINTOSH (Autor:in) / MCGRATH PETER THOMAS (Autor:in)
30.06.2015
Patent
Elektronische Ressource
Englisch
IPC:
B05D
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
,
Verfahren zum Aufbringen von Flüssigkeiten oder von anderen fließfähigen Stoffen auf Oberflächen allgemein
/
C23C
Beschichten metallischer Werkstoffe
,
COATING METALLIC MATERIAL
/
C04B
Kalk
,
LIME
/
H05K
PRINTED CIRCUITS
,
Gedruckte Schaltungen
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