Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique
Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique
Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique
Hong, S.J. (Autor:in) / Park, B.-H. (Autor:in) / Seo, D.S. (Autor:in) / Ryu, C.-R. (Autor:in)
SURFACE ENGINEERING -LONDON- ; 24 ; 337-340
01.01.2008
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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