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Solid PCD cutter
A cutting element may be formed by placing a plurality of diamond particles adjacent to a substrate in a reaction cell and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body. The polycrystalline diamond body may have a cutting face area to thickness ratio ranging from 60:16 to 500:5 and at least one dimension greater than 8 mm.
Solid PCD cutter
A cutting element may be formed by placing a plurality of diamond particles adjacent to a substrate in a reaction cell and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body. The polycrystalline diamond body may have a cutting face area to thickness ratio ranging from 60:16 to 500:5 and at least one dimension greater than 8 mm.
Solid PCD cutter
EYRE RONALD K (Autor:in) / BELNAP JOHN DANIEL (Autor:in) / ZHANG YOUHE (Autor:in) / SHEN YUELIN (Autor:in) / SHI JIBIN (Autor:in) / BURHAN YURI (Autor:in)
01.11.2016
Patent
Elektronische Ressource
Englisch