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Solid PCD cutter
A cutting element may be formed by placing a plurality of diamond particles adjacent to a substrate in a reaction cell and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body. The polycrystalline diamond body may have a cutting face area to thickness ratio ranging from 60:16 to 500:5 and at least one dimension greater than 8 mm.
Solid PCD cutter
A cutting element may be formed by placing a plurality of diamond particles adjacent to a substrate in a reaction cell and subjecting the plurality of diamond particles to high pressure high temperature conditions to form a polycrystalline diamond body. The polycrystalline diamond body may have a cutting face area to thickness ratio ranging from 60:16 to 500:5 and at least one dimension greater than 8 mm.
Solid PCD cutter
EYRE RONALD K (author) / BELNAP JOHN DANIEL (author) / ZHANG YOUHE (author) / SHEN YUELIN (author) / SHI JIBIN (author) / BURHAN YURI (author)
2016-11-01
Patent
Electronic Resource
English