Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Insulating substrates including through holes
It is provided an insulating substrate including through holes 2 for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 300 μm , and a diameter of the through hole is 20 to 100 μm . The insulating substrate is composed of an alumina sintered body. A relative density and an average grain size of the alumina sintered body is 99.5 percent or higher and 2 to 50 μm , respectively.
Insulating substrates including through holes
It is provided an insulating substrate including through holes 2 for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 300 μm , and a diameter of the through hole is 20 to 100 μm . The insulating substrate is composed of an alumina sintered body. A relative density and an average grain size of the alumina sintered body is 99.5 percent or higher and 2 to 50 μm , respectively.
Insulating substrates including through holes
TAKAGAKI TATSURO (Autor:in) / IWASAKI YASUNORI (Autor:in) / MIYAZAWA SUGIO (Autor:in) / IDE AKIYOSHI (Autor:in) / NAKANISHI HIROKAZU (Autor:in)
13.02.2018
Patent
Elektronische Ressource
Englisch