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A platform for research: civil engineering, architecture and urbanism
Insulating substrates including through holes
It is provided an insulating substrate including through holes 2 for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 300 μm , and a diameter of the through hole is 20 to 100 μm . The insulating substrate is composed of an alumina sintered body. A relative density and an average grain size of the alumina sintered body is 99.5 percent or higher and 2 to 50 μm , respectively.
Insulating substrates including through holes
It is provided an insulating substrate including through holes 2 for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 300 μm , and a diameter of the through hole is 20 to 100 μm . The insulating substrate is composed of an alumina sintered body. A relative density and an average grain size of the alumina sintered body is 99.5 percent or higher and 2 to 50 μm , respectively.
Insulating substrates including through holes
TAKAGAKI TATSURO (author) / IWASAKI YASUNORI (author) / MIYAZAWA SUGIO (author) / IDE AKIYOSHI (author) / NAKANISHI HIROKAZU (author)
2018-02-13
Patent
Electronic Resource
English