Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microcreep of Instrument Grade Beryllium
Elevated temperature uniaxial microcreep experiments show instrument grade beryllium deforms in excess of both design limitations. However, a microstrain hardening process was observed, leading to strain exhaustion, that seems a possibility for improving microcreep strength.
Microcreep of Instrument Grade Beryllium
Elevated temperature uniaxial microcreep experiments show instrument grade beryllium deforms in excess of both design limitations. However, a microstrain hardening process was observed, leading to strain exhaustion, that seems a possibility for improving microcreep strength.
Microcreep of Instrument Grade Beryllium
R. S. Polvani (Autor:in) / B. W. Christ (Autor:in)
1979
5 pages
Report
Keine Angabe
Englisch
Microcreep of rapidly solidified Sn-0.7wt.% Cu-In solder alloys
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Beryllium and beryllium alloys
| Engineering Index Backfile | 1936
Beryllium and beryllium alloys
| Engineering Index Backfile | 1936
| NTIS | 1958