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Does back cooling improve human thermal comfort in warm environments? A device for heat conduction by the semiconductor Peltier effect
Does back cooling improve human thermal comfort in warm environments? A device for heat conduction by the semiconductor Peltier effect
Does back cooling improve human thermal comfort in warm environments? A device for heat conduction by the semiconductor Peltier effect
Build. Simul.
He, Mengyuan (Autor:in) / Liu, Hong (Autor:in) / Shao, Lianggen (Autor:in) / Li, Baizhan (Autor:in) / Wu, Yuxin (Autor:in)
Building Simulation ; 17 ; 1253-1271
01.08.2024
Aufsatz (Zeitschrift)
Elektronische Ressource
Englisch
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