Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Does back cooling improve human thermal comfort in warm environments? A device for heat conduction by the semiconductor Peltier effect

    New search for: He, Mengyuan
    New search for: Liu, Hong
    New search for: Shao, Lianggen
    New search for: Li, Baizhan
    New search for: Wu, Yuxin

    Access

    Check access
    Check availability in my library
    Order at Subito €

    Access

    Check access
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Does back cooling improve human thermal comfort in warm environments? A device for heat conduction by the semiconductor Peltier effect

    New search for: He, Mengyuan
    New search for: Liu, Hong
    New search for: Shao, Lianggen
    New search for: Li, Baizhan
    New search for: Wu, Yuxin

    Access

    Check access
    Check availability in my library
    Order at Subito €

    Does back cooling improve human thermal comfort in warm environments? A device for heat conduction by the semiconductor Peltier effect

    New search for: He, Mengyuan
    New search for: Liu, Hong
    New search for: Shao, Lianggen
    New search for: Li, Baizhan
    New search for: Wu, Yuxin

    Access

    Check access
    Check availability in my library
    Order at Subito €

    Access

    Check access
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Does back cooling improve human thermal comfort in warm environments? A device for heat conduction by the semiconductor Peltier effect

    Additional title:

    Build. Simul.

    Contributors:

    He, Mengyuan (author) / Liu, Hong (author) / Shao, Lianggen (author) / Li, Baizhan (author) / Wu, Yuxin (author)

    Published in:

    Building Simulation ; 17 ; 1253-1271

    Publication date:

    2024-08-01

    ISSN:

    1996-8744

    DOI:

    https://doi.org/10.1007/s12273-024-1139-0

    Type of media:

    Article (Journal)

    Type of material:

    Electronic Resource

    Language:

    English

    Similar titles

    Does back cooling improve human thermal comfort in warm environments? A device for heat conduction by the semiconductor Peltier effect

    He, Mengyuan / Liu, Hong / Shao, Lianggen et al. | Springer Verlag | 2024

    Dynamic Thermal Receptor Response and Comfort in Cold and Warm Environments

    Janta, Marius / Prestel, Jonas / Senner, Veit et al. | BASE | 2014

    Free access

    Cooling Effect of Thermal Mass for Office Spaces in Warm Environments

    Diaz, C. / Commission of the European Communities | British Library Conference Proceedings | 1993

    Heat-Mitigation Strategies to Improve Pedestrian Thermal Comfort in Urban Environments: A Review

    Nazanin Nasrollahi / Amir Ghosouri / Jamal Khodakarami et al. | DOAJ | 2020

    Free access

    Evaluation of Thermal Comfort in Slightly Warm Ventilated Spaces in Nonuniform Environments

    Conceição, Eusébio Z.E. / Lúcio, M Manuela J.R. / Lourenço, Tiago M.C. et al. | Taylor & Francis Verlag | 2006

    Back to top