A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Conformal Electroless Copper Deposition for sub-0.5 m Interconnect Wiring of Very High Aspect Ratio
Conformal Electroless Copper Deposition for sub-0.5 m Interconnect Wiring of Very High Aspect Ratio
Conformal Electroless Copper Deposition for sub-0.5 m Interconnect Wiring of Very High Aspect Ratio
Lopatin, S. (author) / Shacham-Diamond, Y. (author) / Dubin, V. M. (author) / Vasudev, P. K. (author) / Paunovic, M. / Scherson, D. A. / Electrochemical Society; Electrodeposition Division
Symposium; 3rd, Electrochemically deposited thin films ; 1996 ; San Antonio; TX
1997-01-01
18 pages
Conference paper
English
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