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    Copper Foils for Advanced Printed Wiring Applications

    New search for: Clouser, S.
    New search for: IPC

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    Copper Foils for Advanced Printed Wiring Applications

    New search for: Clouser, S.
    New search for: IPC

    Access

    Access via TIB
    Check availability in my library

    Copper Foils for Advanced Printed Wiring Applications

    New search for: Clouser, S.
    New search for: IPC

    Access

    Access via TIB
    Check availability in my library

    Access

    Access via TIB
    Check availability in my library

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Copper Foils for Advanced Printed Wiring Applications

    Contributors:

    Clouser, S. (author) / IPC

    Conference:

    National conference, Base materials and laminates for the 21st century ; 1996 ; Minneapolis; MN

    Published in:

    Base materials and laminates for the 21st century ; 9:10-9:44

    Publication date:

    1996-01-01

    Size:

    9:10-9:44

    Remarks:

    Held as part of the midwest electronics expo

    Type of media:

    Conference paper

    Type of material:

    Print

    Language:

    English

    Keywords:

    base materials , laminates , IPC

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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