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A platform for research: civil engineering, architecture and urbanism
Disbond detection in adhesively bonded structures using piezoelectric wafer active sensors [5394-09]
Disbond detection in adhesively bonded structures using piezoelectric wafer active sensors [5394-09]
Disbond detection in adhesively bonded structures using piezoelectric wafer active sensors [5394-09]
Cuc, A. (author) / Giurgiutiu, V. (author) / Kundu, Tribikram / International Society for Optical Engineering
Conference; 3rd, Health monitoring and smart nondestructive evaluation of structural and biological systems ; 2004 ; San Diego, CA
2004-01-01
12 pages
Conference paper
English
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