Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Analysis on the Copper Metabolism in Printed Circuit Board Industry

    New search for: Zhu, L.
    New search for: Xu, Y.P.
    New search for: Sun, Q.F.
    New search for: Sun, D.
    New search for: Sung, W.-P.
    New search for: Chen, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Analysis on the Copper Metabolism in Printed Circuit Board Industry

    New search for: Zhu, L.
    New search for: Xu, Y.P.
    New search for: Sun, Q.F.
    New search for: Sun, D.
    New search for: Sung, W.-P.
    New search for: Chen, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Analysis on the Copper Metabolism in Printed Circuit Board Industry

    New search for: Zhu, L.
    New search for: Xu, Y.P.
    New search for: Sun, Q.F.
    New search for: Sun, D.
    New search for: Sung, W.-P.
    New search for: Chen, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Analysis on the Copper Metabolism in Printed Circuit Board Industry

    Contributors:

    Zhu, L. (author) / Xu, Y.P. (author) / Sun, Q.F. (author) / Sun, D. / Sung, W.-P. / Chen, R.

    Conference:

    Conference, Frontiers of green building, materials and civil engineering; (GBMCE 2011) ; 2011 ; Shangri-La, China

    Published in:

    Frontiers of green building, materials and civil engineering; (GBMCE 2011) ; 2860-2866

    APPLIED MECHANICS AND MATERIALS ; 71/78

    Publication date:

    2011-01-01

    Size:

    7 pages

    Remarks:

    International conference proceedings; Includes bibliographical references and index

    ISBN:

    9783037852033

    Type of media:

    Conference paper

    Type of material:

    Print

    Language:

    English

    Keywords:

    Green building , Materials , Civil engineering

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Preparation method of copper paste printed circuit board

    ZHAO JINGWEI / NIE FENG | European Patent Office | 2020

    Free access

    Acidic Copper Plating Technology of Printed Circuit Board

    Wang, Z.-j. / Yang, L. / Liu, H.-f. | British Library Online Contents | 2003

    Surface treated copper foil, copper clad laminate, and printed circuit board

    MIYAMOTO NOBUAKI / MIKI ATSUSHI | European Patent Office | 2022

    Free access

    Surface finishes of rolled copper foil for flexible printed circuit board

    Lee, C. Y. / Moon, W. C. / Jung, S. B. | British Library Online Contents | 2008

    Copper Leaching Behavior from Waste Printed Circuit Board in Ammoniacal Alkaline Solution

    Koyama, K. / Tanaka, M. / Lee, J.-c. | British Library Online Contents | 2006

    Back to top