A platform for research: civil engineering, architecture and urbanism
Problems of adhesion of polyimides used in microelectronics
Problems of adhesion of polyimides used in microelectronics
Problems of adhesion of polyimides used in microelectronics
Rabilloud, G. (author)
DOUBLE LIAISON ; 39 ; XVIII
1992-01-01
XVIII
Article (Journal)
Unknown
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Corrosion of parts used for microelectronics applications
British Library Online Contents | 1997
|British Library Online Contents | 2004
|British Library Online Contents | 2000
|Aurum Thermoplastic Polyimides
British Library Online Contents | 1995
|British Library Online Contents | 2011