A platform for research: civil engineering, architecture and urbanism
Corrosion of parts used for microelectronics applications
Corrosion of parts used for microelectronics applications
Corrosion of parts used for microelectronics applications
Brand, U. J. (author) / Buehler, H.-E. (author) / Froehlich, T. (author) / Koehler, S. (author)
WERKSTOFFE UND KORROSION -WEINHEIM- ; 48 ; 243-251
1997-01-01
9 pages
Article (Journal)
German
DDC:
620.11223
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Electromigration - a typical corrosion phenomenon in microelectronics
British Library Online Contents | 1995
|Problems of adhesion of polyimides used in microelectronics
British Library Online Contents | 1992
|Chemical mechanical planarization for microelectronics applications
British Library Online Contents | 2004
|Corrosion study at Cu-Al interface in microelectronics packaging
British Library Online Contents | 2002
|Why Microelectronics and Packaging? Wireless Applications
British Library Online Contents | 2001
|