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Closed porosity aluminosilicate for electronic packaging applications
Closed porosity aluminosilicate for electronic packaging applications
Closed porosity aluminosilicate for electronic packaging applications
Hietala, S. L. (author) / Smith, D. M. (author) / Hietala, V. M. (author) / Brinker, C. J. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 8 ; 1122
1993-01-01
1122 pages
Article (Journal)
Unknown
DDC:
620.11
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Metallic sandwiches with open porosity facings and closed porosity cores for SOFC interconnects
British Library Online Contents | 2013
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