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    Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites

    New search for: Lee, J. S.
    New search for: Kim, T. H.
    New search for: Lee, K. H.
    New search for: Komninou, P.
    New search for: Rocher, A.

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    Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites

    New search for: Lee, J. S.
    New search for: Kim, T. H.
    New search for: Lee, K. H.
    New search for: Komninou, P.
    New search for: Rocher, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites

    New search for: Lee, J. S.
    New search for: Kim, T. H.
    New search for: Lee, K. H.
    New search for: Komninou, P.
    New search for: Rocher, A.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Microstructural Investigation of Grain Boundary Diffusion and Recrystallization in W-Cu Composites

    Contributors:

    Lee, J. S. (author) / Kim, T. H. (author) / Lee, K. H. (author) / Komninou, P. / Rocher, A.

    Published in:

    Intergranular and Interphase Boundaries in Materials ; 399

    MATERIALS SCIENCE FORUM

    Publication date:

    1993-01-01

    Size:

    399 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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