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    Characterisation of Silver Filled Adhesives for Attachment of Microelectronic Chips to Substrates

    New search for: Bjorneklett, A.

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    Characterisation of Silver Filled Adhesives for Attachment of Microelectronic Chips to Substrates

    New search for: Bjorneklett, A.

    Access

    Access via TIB
    Check availability in my library
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    Characterisation of Silver Filled Adhesives for Attachment of Microelectronic Chips to Substrates

    New search for: Bjorneklett, A.

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    Access via TIB
    Check availability in my library
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    Document information
    Title:

    Characterisation of Silver Filled Adhesives for Attachment of Microelectronic Chips to Substrates

    Contributors:

    Bjorneklett, A. (author)

    Published in:

    POLYMERS AND POLYMER COMPOSITES ; 1 ; 275

    Publication date:

    1993-01-01

    Size:

    275 pages

    ISSN:

    0967-3911

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.192

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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