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    Cure Behavior of Encapsulation Materials for Microelectronic Assembly of Bare IC Chips

    New search for: Palit, K.

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    Cure Behavior of Encapsulation Materials for Microelectronic Assembly of Bare IC Chips

    New search for: Palit, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Cure Behavior of Encapsulation Materials for Microelectronic Assembly of Bare IC Chips

    New search for: Palit, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Cure Behavior of Encapsulation Materials for Microelectronic Assembly of Bare IC Chips

    Contributors:

    Palit, K. (author)

    Published in:

    JOURNAL OF REINFORCED PLASTICS AND COMPOSITES ; 12 ; 1190

    Publication date:

    1993-01-01

    Size:

    1190 pages

    ISSN:

    0731-6844

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.1923

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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