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Ceramic joining II Partial transient liquid-phase bonding of alumina via Cu/Ni/Cu multilayer interlayers
Ceramic joining II Partial transient liquid-phase bonding of alumina via Cu/Ni/Cu multilayer interlayers
Ceramic joining II Partial transient liquid-phase bonding of alumina via Cu/Ni/Cu multilayer interlayers
Shalz, M. L. (author) / Dalgleish, B. J. (author) / Tomsia, A. P. (author) / Glaeser, A. M. (author)
JOURNAL OF MATERIALS SCIENCE ; 29 ; 3200
1994-01-01
3200 pages
Article (Journal)
Unknown
DDC:
620.11
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