Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Partial transient liquid-phase bonding of Si~3N~4 with Ti/Cu/Ni multi-interlayers

    New search for: Zheng, C.
    New search for: Lou, H.
    New search for: Fei, Z.
    New search for: Li, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Partial transient liquid-phase bonding of Si~3N~4 with Ti/Cu/Ni multi-interlayers

    New search for: Zheng, C.
    New search for: Lou, H.
    New search for: Fei, Z.
    New search for: Li, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Partial transient liquid-phase bonding of Si~3N~4 with Ti/Cu/Ni multi-interlayers

    New search for: Zheng, C.
    New search for: Lou, H.
    New search for: Fei, Z.
    New search for: Li, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Partial transient liquid-phase bonding of Si~3N~4 with Ti/Cu/Ni multi-interlayers

    Contributors:

    Zheng, C. (author) / Lou, H. (author) / Fei, Z. (author) / Li, Z. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE LETTERS ; 16 ; 2026-2028

    Publication date:

    1997-01-01

    Size:

    3 pages

    ISSN:

    0261-8028

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Ceramic joining: Part I Partial transient liquid-phase bonding of alumina via Cu/Pt interlayers

    Shalz, M. L. / Dalgleish, B. J. / Tomsia, A. P. et al. | British Library Online Contents | 1993

    Ceramic joining II Partial transient liquid-phase bonding of alumina via Cu/Ni/Cu multilayer interlayers

    Shalz, M. L. / Dalgleish, B. J. / Tomsia, A. P. et al. | British Library Online Contents | 1994

    Transient liquid phase bonding of a microduplex stainless steel using amorphous interlayers

    Khan, T. I. / Orhan, N. / Eroglu, M. | British Library Online Contents | 2002

    Rapid transient-liquid-phase bonding of Al~2O~3 with microdesigned Ni/Nb/Ni interlayers

    Hong, S.M. / Reynolds, T.B. / Bartlow, C.C. et al. | British Library Online Contents | 2010

    Overview of transient liquid phase and partial transient liquid phase bonding

    Cook, G. O. / Sorensen, C. D. | British Library Online Contents | 2011

    Back to top