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    The effects of descaling treatments on intermetallic formation and thermomechanical stability of electroplated tin/lead layer in a semiconductor leadframe alloy

    New search for: Chung, T. Y.
    New search for: Cho, T. J.
    New search for: Kim, Y. G.

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    The effects of descaling treatments on intermetallic formation and thermomechanical stability of electroplated tin/lead layer in a semiconductor leadframe alloy

    New search for: Chung, T. Y.
    New search for: Cho, T. J.
    New search for: Kim, Y. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    The effects of descaling treatments on intermetallic formation and thermomechanical stability of electroplated tin/lead layer in a semiconductor leadframe alloy

    New search for: Chung, T. Y.
    New search for: Cho, T. J.
    New search for: Kim, Y. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    The effects of descaling treatments on intermetallic formation and thermomechanical stability of electroplated tin/lead layer in a semiconductor leadframe alloy

    Contributors:

    Chung, T. Y. (author) / Cho, T. J. (author) / Kim, Y. G. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE LETTERS ; 13 ; 1465

    Publication date:

    1994-01-01

    Size:

    1465 pages

    ISSN:

    0261-8028

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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