Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
The effects of descaling treatments on intermetallic formation and thermomechanical stability of electroplated tin/lead layer in a semiconductor leadframe alloy
The effects of descaling treatments on intermetallic formation and thermomechanical stability of electroplated tin/lead layer in a semiconductor leadframe alloy
The effects of descaling treatments on intermetallic formation and thermomechanical stability of electroplated tin/lead layer in a semiconductor leadframe alloy
Chung, T. Y. (Autor:in) / Cho, T. J. (Autor:in) / Kim, Y. G. (Autor:in)
JOURNAL OF MATERIALS SCIENCE LETTERS ; 13 ; 1465
01.01.1994
1465 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC:
620.11
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