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Prediction of Creep Properties of Chipboard Used in Stressed-Skin Panels
Prediction of Creep Properties of Chipboard Used in Stressed-Skin Panels
Prediction of Creep Properties of Chipboard Used in Stressed-Skin Panels
Kliger, I. R. (author) / Pellicane, P. J. (author)
JOURNAL OF TESTING AND EVALUATION ; 23 ; 408
1995-01-01
408 pages
Article (Journal)
Unknown
DDC:
620
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