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Effect of thermal residual stress on the crack path in adhesively bonded joints

Daghyani, H. R. / Ye, L. / Mai, Y.-W.

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Effect of thermal residual stress on the crack path in adhesively bonded joints

Daghyani, H. R. / Ye, L. / Mai, Y.-W.

Effect of thermal residual stress on the crack path in adhesively bonded joints

Daghyani, H. R. / Ye, L. / Mai, Y.-W.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Effect of thermal residual stress on the crack path in adhesively bonded joints

Contributors:

Daghyani, H. R. (author) / Ye, L. (author) / Mai, Y.-W. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE ; 31 ; 2523-2529

Publication date:

1996-01-01

Size:

7 pages

ISSN:

0022-2461

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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