Stress in Al, AlSiCu, and AlVPd films on oxidized Si substrates: Fid-Bau Portal

Stress in Al, AlSiCu, and AlVPd films on oxidized Si substrates

Leusink, G. J. / Lokker, J. P. / Van den Homberg, M. J. C. / Jongste, J. F. / Oosterlaken, T. G. M. / Janssen, G. C. A. M. / Radelaar, S.

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Stress in Al, AlSiCu, and AlVPd films on oxidized Si substrates

Leusink, G. J. / Lokker, J. P. / Van den Homberg, M. J. C. / Jongste, J. F. / Oosterlaken, T. G. M. / Janssen, G. C. A. M. / Radelaar, S.

Stress in Al, AlSiCu, and AlVPd films on oxidized Si substrates

Leusink, G. J. / Lokker, J. P. / Van den Homberg, M. J. C. / Jongste, J. F. / Oosterlaken, T. G. M. / Janssen, G. C. A. M. / Radelaar, S.

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Title:

Stress in Al, AlSiCu, and AlVPd films on oxidized Si substrates

Contributors:

Leusink, G. J. (author) / Lokker, J. P. (author) / Van den Homberg, M. J. C. (author) / Jongste, J. F. (author) / Oosterlaken, T. G. M. (author) / Janssen, G. C. A. M. (author) / Radelaar, S. (author) / Gessner, T / Schulz, S. E.

Published in:

Materials for Advanced Metallization ; 215-219

APPLIED SURFACE SCIENCE ; 91

Publication date:

1996-01-01

Size:

5 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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