Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Mechanism of void formation in TiN/AlSiCu/TiN/plasma-enhanced tetraethyl orthosilicate SiO2 multi-layer structures via high-temperature stress migration

    New search for: Naoe, Takuya
    New search for: Endoh, Hirohiko
    New search for: Fuchino, Fumihiro
    New search for: Miyata, Masanori
    New search for: Miyake, Hidetsugu
    New search for: Takahashi, Takuya
    New search for: Fujimoto, Takaaki

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Mechanism of void formation in TiN/AlSiCu/TiN/plasma-enhanced tetraethyl orthosilicate SiO2 multi-layer structures via high-temperature stress migration

    New search for: Naoe, Takuya
    New search for: Endoh, Hirohiko
    New search for: Fuchino, Fumihiro
    New search for: Miyata, Masanori
    New search for: Miyake, Hidetsugu
    New search for: Takahashi, Takuya
    New search for: Fujimoto, Takaaki

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Mechanism of void formation in TiN/AlSiCu/TiN/plasma-enhanced tetraethyl orthosilicate SiO2 multi-layer structures via high-temperature stress migration

    New search for: Naoe, Takuya
    New search for: Endoh, Hirohiko
    New search for: Fuchino, Fumihiro
    New search for: Miyata, Masanori
    New search for: Miyake, Hidetsugu
    New search for: Takahashi, Takuya
    New search for: Fujimoto, Takaaki

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Mechanism of void formation in TiN/AlSiCu/TiN/plasma-enhanced tetraethyl orthosilicate SiO2 multi-layer structures via high-temperature stress migration

    Contributors:

    Naoe, Takuya (author) / Endoh, Hirohiko (author) / Fuchino, Fumihiro (author) / Miyata, Masanori (author) / Miyake, Hidetsugu (author) / Takahashi, Takuya (author) / Fujimoto, Takaaki (author)

    Published in:

    Materials science in semiconductor processing ; 83 ; 239-248

    Publication date:

    2018-01-01

    Size:

    10 pages

    ISSN:

    1369-8001

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.38152

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Mechanism of void formation in TiN/AlSiCu/TiN/plasma-enhanced tetraethyl orthosilicate SiO2 multi-layer structures via high-temperature stress migration

    Naoe, Takuya / Endoh, Hirohiko / Fuchino, Fumihiro et al. | British Library Online Contents | 2018

    Storage Stability of Tetraethyl Orthosilicate Hydrolyzate

    Li, Chong / Hou, Rui-gang | British Library Online Contents | 2015

    Gas-Phase Hydrolysis of Tetraethyl Orthosilicate (TEOS)

    Zabicky, J. / Realpe, H. | British Library Online Contents | 1999

    SiC-SiO2 nanocomposite films prepared by laser CVD using tetraethyl orthosilicate and acetylene as precursors

    Yu, S. / Tu, R. / Ito, A. et al. | British Library Online Contents | 2010

    Comprehensive performances of carbon nanotube reinforced foam concrete with tetraethyl orthosilicate impregnation

    Luo, Jianlin | Online Contents | 2017

    Back to top