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    LPCVD Re~xSi~yN~z diffusion barriers in Si/SiO~2/Cu metallizations

    New search for: Dutron, A.-M.
    New search for: Blanquet, E.
    New search for: Bernard, C.
    New search for: Bachli, A.
    New search for: Madar, R.
    New search for: Gessner, T.
    New search for: Schulz, S. E.

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    LPCVD Re~xSi~yN~z diffusion barriers in Si/SiO~2/Cu metallizations

    New search for: Dutron, A.-M.
    New search for: Blanquet, E.
    New search for: Bernard, C.
    New search for: Bachli, A.
    New search for: Madar, R.
    New search for: Gessner, T.
    New search for: Schulz, S. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    LPCVD Re~xSi~yN~z diffusion barriers in Si/SiO~2/Cu metallizations

    New search for: Dutron, A.-M.
    New search for: Blanquet, E.
    New search for: Bernard, C.
    New search for: Bachli, A.
    New search for: Madar, R.
    New search for: Gessner, T.
    New search for: Schulz, S. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
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    Document information
    Title:

    LPCVD Re~xSi~yN~z diffusion barriers in Si/SiO~2/Cu metallizations

    Contributors:

    Dutron, A.-M. (author) / Blanquet, E. (author) / Bernard, C. (author) / Bachli, A. (author) / Madar, R. (author) / Gessner, T. / Schulz, S. E.

    Published in:

    Materials for Advanced Metallization ; 277-284

    APPLIED SURFACE SCIENCE ; 91

    Publication date:

    1996-01-01

    Size:

    8 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.35

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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