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    Stress-Induced Voiding in Microelectronic Metallization: Void Growth Models and Refinements

    New search for: Sullivan, T. D.

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    Stress-Induced Voiding in Microelectronic Metallization: Void Growth Models and Refinements

    New search for: Sullivan, T. D.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Stress-Induced Voiding in Microelectronic Metallization: Void Growth Models and Refinements

    New search for: Sullivan, T. D.

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Title:

    Stress-Induced Voiding in Microelectronic Metallization: Void Growth Models and Refinements

    Contributors:

    Sullivan, T. D. (author)

    Published in:

    ANNUAL REVIEW OF MATERIALS SCIENCE ; 26 ; 333-364

    Publication date:

    1996-01-01

    Size:

    32 pages

    ISSN:

    0084-6600

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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