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    Thermal stresses analysis of a three-dimensional crack in a thermopiezoelectric solid

    New search for: Shang, F.
    New search for: Wang, Z.
    New search for: Li, Z.

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    Thermal stresses analysis of a three-dimensional crack in a thermopiezoelectric solid

    New search for: Shang, F.
    New search for: Wang, Z.
    New search for: Li, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Thermal stresses analysis of a three-dimensional crack in a thermopiezoelectric solid

    New search for: Shang, F.
    New search for: Wang, Z.
    New search for: Li, Z.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Thermal stresses analysis of a three-dimensional crack in a thermopiezoelectric solid

    Contributors:

    Shang, F. (author) / Wang, Z. (author) / Li, Z. (author)

    Published in:

    ENGINEERING FRACTURE MECHANICS ; 55 ; 737-750

    Publication date:

    1996-01-01

    Size:

    14 pages

    ISSN:

    0013-7944

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 126

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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