Effect of thermal cycling on stresses in thin silicon nitride and silicon carbide films: Fid-Bau Portal

Effect of thermal cycling on stresses in thin silicon nitride and silicon carbide films

Lim, C. W. / Toh, C. C. / Fu, J. K. / Lahiri, S. K.

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Effect of thermal cycling on stresses in thin silicon nitride and silicon carbide films

Lim, C. W. / Toh, C. C. / Fu, J. K. / Lahiri, S. K.

Effect of thermal cycling on stresses in thin silicon nitride and silicon carbide films

Lim, C. W. / Toh, C. C. / Fu, J. K. / Lahiri, S. K.

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Check availability in my library

Order at Subito €

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Document information

Title:

Effect of thermal cycling on stresses in thin silicon nitride and silicon carbide films

Contributors:

Lim, C. W. (author) / Toh, C. C. (author) / Fu, J. K. (author) / Lahiri, S. K. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE LETTERS ; 15 ; 2177-2179

Publication date:

1996-01-01

Size:

3 pages

ISSN:

0261-8028

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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