A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Microstructure and strength of Al-sapphire interface by means of the surface activated bonding method
Microstructure and strength of Al-sapphire interface by means of the surface activated bonding method
Microstructure and strength of Al-sapphire interface by means of the surface activated bonding method
Akatsu, T. (author) / Sasaki, G. (author) / Hosoda, N. (author) / Suga, T. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 12 ; 852-856
1997-01-01
5 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Microstructure of Al/-Al~2O~3 Interface Fabricated by Surface Activated Bonding at Room Temperature
| British Library Online Contents | 1999
Atomic structure of Al/Al interface formed by surface activated bonding
| British Library Online Contents | 1999
Strength theory of imperfect-bonding interface
| British Library Online Contents | 1998
Sapphire surface high-continuous-strength coating and preparation process thereof
| European Patent Office | 2024
Direct bonding of CMP-Cu films by surface activated bonding (SAB) method
| British Library Online Contents | 2005