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    Direct bonding of CMP-Cu films by surface activated bonding (SAB) method

    New search for: Shigetou, A.
    New search for: Itoh, T.
    New search for: Suga, T.

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    Direct bonding of CMP-Cu films by surface activated bonding (SAB) method

    New search for: Shigetou, A.
    New search for: Itoh, T.
    New search for: Suga, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Direct bonding of CMP-Cu films by surface activated bonding (SAB) method

    New search for: Shigetou, A.
    New search for: Itoh, T.
    New search for: Suga, T.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Direct bonding of CMP-Cu films by surface activated bonding (SAB) method

    Contributors:

    Shigetou, A. (author) / Itoh, T. (author) / Suga, T. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 40 ; 3149-3154

    Publication date:

    2005-01-01

    Size:

    6 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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