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Factors Affecting Adhesion at Copper-Polyamide 11 and Aluminum-Polyamide 11 Interfaces
Factors Affecting Adhesion at Copper-Polyamide 11 and Aluminum-Polyamide 11 Interfaces
Factors Affecting Adhesion at Copper-Polyamide 11 and Aluminum-Polyamide 11 Interfaces
Gundjian, M. (author) / Fisa, B. (author)
JOURNAL OF THERMOPLASTIC COMPOSITE MATERIALS ; 10 ; 416-434
1997-01-01
19 pages
Article (Journal)
English
DDC:
620.118
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