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    Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites

    New search for: Legois, V.
    New search for: Aucouturier, M.
    New search for: Ollivier, E.
    New search for: Darque-Ceretti, E.
    New search for: Macheto, P.

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    Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites

    New search for: Legois, V.
    New search for: Aucouturier, M.
    New search for: Ollivier, E.
    New search for: Darque-Ceretti, E.
    New search for: Macheto, P.

    Access

    Check availability in my library
    Order at Subito €
    Access via TIB

    Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites

    New search for: Legois, V.
    New search for: Aucouturier, M.
    New search for: Ollivier, E.
    New search for: Darque-Ceretti, E.
    New search for: Macheto, P.

    Access

    Check availability in my library
    Order at Subito €
    Access via TIB

    Access

    Check availability in my library
    Order at Subito €
    Access via TIB

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites

    Contributors:

    Legois, V. ( author ) / Aucouturier, M. ( author ) / Ollivier, E. ( author ) / Darque-Ceretti, E. ( author ) / Macheto, P. ( author )

    Published in:

    SURFACE ENGINEERING -LONDON- ; 14 ; 259-264

    Publication date:

    1998-01-01

    Size:

    6 pages

    ISSN:

    0267-0844

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.44

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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