A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Y~1Ba~2Cu~3O~7~-~x multilayer structures with a thick SiO~2 interlayer for multichip modules
Y~1Ba~2Cu~3O~7~-~x multilayer structures with a thick SiO~2 interlayer for multichip modules
Y~1Ba~2Cu~3O~7~-~x multilayer structures with a thick SiO~2 interlayer for multichip modules
Afonso, S. (author) / Chen, K. Y. (author) / Xiong, Q. (author) / Tang, Y. Q. (author) / Salamo, G. J. (author) / Chan, F. T. (author) / Cooksey, J. (author) / Scott, S. (author) / Shi, Y. J. (author) / Ang, S. (author)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 12 ; 2947-2951
1997-01-01
5 pages
Article (Journal)
English
DDC:
620.11
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