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    Atom diffusion behavior and bonding strength of Ag/Cu composite interface

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    Atom diffusion behavior and bonding strength of Ag/Cu composite interface

    New search for: Zeng, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Atom diffusion behavior and bonding strength of Ag/Cu composite interface

    New search for: Zeng, J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Check availability in my library
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    Document information
    Title:

    Atom diffusion behavior and bonding strength of Ag/Cu composite interface

    Contributors:

    Zeng, J. (author)

    Published in:

    RARE METALS -BEIJING- ENGLISH EDITION ; 17 ; 238-241

    Publication date:

    1998-01-01

    Size:

    4 pages

    ISSN:

    1001-0521

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  669

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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